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System in Package Market: Description
A System in Package can also be called a Multi-Chip Module (MCM), which is an electronic device that looks like a single Integrated Circuit (IC) to a system designer, but actually its purpose is to contain the functions of all the components. System in package (SIP) technology generally refers to a module where number of integrated circuits are enclosed and they create various enhanced packaging applications which is used to build up solutions that can be customized as per the users requirement.
SIP is largely used in digital music player, mobile phones, and in many electronic functions. Systems on Chip I.e., SOC, have several advantages, such as flexibility, low product cost, low research and development cost, and low NRE cost among others.
Source: WMR
System in Package (SIP) Market: Overview
The system in package (SIP) market size is valued at USD 24,302.85 million by 2033 which is expected to grow at a compound annual growth rate (CAGR) of 10.40% in the forecast period.
The growth of System of Package market over the forecast period is influenced by high adoption of smartphones and smart wearables. The introduction of 5G network connected devices has also raised the demand for system in package technology in order to incorporate 5G supporting components. It is also anticipated that it will flourish the growth of the system in package (SiP) technology market. The high cost of SIP and increase in the level of integration which leads to thermal issues are expected to act as the major limitations for the growth of system in package (SiP) market, whereas the limited availability of resources and skills can challenge the system in package (SiP) technology market growth in the forecast period. The focus of System in Package is to create a System instead of a Component. SIP also uses silicon from the best individual processes to achieve the desired integration.
Source: WMR
System in Package Market: Key Trends
Boom in portable electronic market and an increase in popularity of Internet of Things have increased the demand
The increase in demand for high speed and compact size of electronic products have ignited the requirement of SIP technology market. In addition to this, module size reduction along with enhanced electrical and thermal performance are also the key requirements of portable electronic products such as smartphones, digital camera & camcorders, laptops & tablets, and household electronics. Also, Internet of Things have gained popularity in the industry, also now considered as the third wave of technology, which is the key player behind the rise of SIP market.
Usage in graphic cards and processors used in real world gaming has helped the market grow
The System in Package (SIP) technology has found significant applications in the graphics cards and processors used in real-world gaming, and this has helped to boost the growth of the SIP market. The demand for high-performance gaming systems has been on the rise due to the growing popularity of esports and other online gaming platforms, and this has resulted in an increased demand for high-performance graphics cards and processors.SIP technology offers several benefits over traditional packaging solutions, such as increased functionality, reduced size, and enhanced reliability. These benefits are particularly relevant in the gaming industry, where high-performance and compact electronic components are critical to delivering an immersive gaming experience.
In addition, the increasing adoption of Artificial Intelligence (AI) and Machine Learning (ML) technologies in gaming systems is also driving the demand for high-performance processors, which can be packaged more efficiently using SIP technology. This has helped to further fuel the growth of the SIP market.Overall, the usage of SIP technology in graphic cards and processors used in real-world gaming has been a significant driver of the SIP market's growth, and this trend is expected to continue in the coming years, driven by the increasing demand for high-performance gaming systems and the ongoing advancements in semiconductor and packaging technologies.
System in Package market: Segmentation Analysis
Key Players:
Amkor Technology
Access, Analog Devices
Apple
ARM
ASE Group
Avago
AT&S
Bosch
Broadcom
Carsem
China WLCSP
Chipbond
ChipMOS
Cisco
Continental
Cyntec
Cypress
Semiconductor
Deca Technologies
Dyconex
Fitbit
Flexceed
Flip Chip International
Formosa
Fraunhofer IZM
Freescale
Fujikura
Fujitsu
GaN Systems
General Electric
GlobalFoundries
Hana Micron
Hella
Huawei
IMEC
Inari Berhad
Infineon
Intel
J-Devices
JCET
King Yuan
Lenovo
Linear Technology
LB Semicon
MediaTek
Medtronic
Meiko
Microchip
Microsemi
Nanium
Nepes
Nvidia
NXP
Nokia
ON Semiconductor
Others.
SIP Market by packaging technology:
2-D IC packaging
2.5-D IC packaging
3-D IC packaging
3-D IC packaging provides 3D design planning, implementation, and system analysis in a single cockpit. It also enables hardware and software co-verification and full-system power analysis with the use of emulation and prototyping, and chiplet-based PHY IP which is used for connectivity with power, performance, and area (PPA) optimized for latency and power.
SIP Market by Package Type:
Ball Grid Array (BGA)
Surface Mount Package (SOP)
Pin Grid Array (PGA)
Others
Pin grid array has been segmented into flip chip pin grid array (PGA), ceramic pin grid array (CPGA), and others.
SIP Market by Packaging Methods:
Wire Bond
Flip Chip
Wire bond always requires a preceding die attachment process to mount the die onto the substrate, such as a lead frame or multilayer substrate. The Flip Chip segment is expected to witness a rapid growth due to increase in demand for integrated chips in consumer electronics sector.
Source: WMR
SIP Market by device:
RF Front- End
RF Amplifier
SIP Market by Application:
Consumer Electronics
o Wearables
o Cameras
o Mobile Handsets
o Others
Telecom, Communications and Infrastructure
Industrial
Others
SIP market is growing at a steady rate. SIP is used in consumer electronics, such as mobile phone, laptops, digital cameras, etc. The telecommunication segment offers a lucrative scope to industry players, and is expected to exhibit higher growth as compared to the other segments. Other application that are helping the growth of SIP are Industrial Systems, Automotive and Transportation, Aerospace and Defence, and Healthcare.
System in Package market: Regional Analysis
North America is expected to grow the demand for system in package technology because of increase in implementation of connected devices, rapid investment for expansion of 5G, across all the sectors to automate the various workflow for better efficiency. The market is segmented into North America, Europe, Asia-Pacific, and LAMEA. Also, Asia-Pacific is accounted for the largest revenue share in the global market, due to the increase in demand for semiconductor devices and portable devices.
System in Package market: Competitive ambit
The prominent companies operating in the marketplace are Amkor Technology, Access, Analog Devices, Apple, ARM, ASE Group, Avago, AT&S, Bosch, Broadcom, Carsem, China WLCSP, Chipbond, ChipMOS, Cisco, Continental, Cyntec, Cypress, Semiconductor, Deca Technologies, Dyconex, Facebook, Fitbit, Flexceed, Flip Chip International, Formosa, Fraunhofer IZM, Freescale, Fujikura, Fujitsu, GaN Systems, General Electric, GlobalFoundries, Google, Hana Micron, Hella, Huawei, IMEC, Inari Berhad, Infineon, Intel, J-Devices, JCET, King Yuan, Lenovo, Linear Technology, LB Semicon, MediaTek, Medtronic, Meiko, Microchip, Microsemi, Nanium, Nepes, Nvidia, NXP, Nokia, ON Semiconductor, and Others.
Report Scope:
SIP Market Forecast Year: 2023-2033
SIP Market Historical Year: 2020-2021
SIP Market 2033: USD 24,302.85 million
SIP Market CAGR: 10.40%
Key Segments: Packaging Technology; Packaging Type; Interconnection Technology; Application
Key Regions and Countries: North America, Europe, Asia-Pacific and LAMEA.
1. Global System in Package (SIP) Market Introduction and Market Overview
1.1. Objective of the Market Research Study
1.2. System in Package (SIP) Market Definition & Description
1.3. Research Data Parameters & Reporting Timelines
1.3.1. Historical Data Reporting Years 2020 to 2021
1.3.2. Projected Data Reporting Years 2023 to 2033
1.3.3. Reporting Data Parameters Value (US$ Million) & Volume (Units)
1.4. Global System in Package (SIP) Market Scope and Market Estimation
1.4.1. Global System in Package (SIP) Overall Market Size (US$ Million) & (Units), Market CAGR (%), Market Estimates & Forecast (2020 to 2033)
1.4.2. Global System in Package (SIP) Market Revenue Share (%) and Growth Rate (Y-o-Y) from 2020 to 2033
1.5. System in Package (SIP) Market Segmentation
1.5.1. Package Type of Global System in Package (SIP) Market
1.5.2. Packaging Technology of Global System in Package (SIP) Market
1.5.3. Packaging Method of Global System in Package (SIP) Market
1.5.4. Device of Global System in Package (SIP) Market
1.5.5. Application of Global System in Package (SIP) Market
1.5.6. Key Regions of Global System in Package (SIP) Market
2. Global System in Package (SIP) Market - Executive Summary
2.1. Global System in Package (SIP) Market Summary & Snapshot
2.2. Global System in Package (SIP) Market, By Package Type(US$ Million) & (Units)
2.3. Global System in Package (SIP) Market, By Packaging Technology (US$ Million) & (Units)
2.4. Global System in Package (SIP) Market, By Packaging Method (US$ Million) & (Units)
2.5. Global System in Package (SIP) Market, By Device (US$ Million) & (Units)
2.6. Global System in Package (SIP) Market, By Application (US$ Million) & (Units)
2.7. Global System in Package (SIP) Market, By Geography (US$ Million) & (Units)
2.8. Global System in Package (SIP) Market Outlook & Future Opportunities
3. System in Package (SIP) Market Trends, Outlook, and Factors Analysis
3.1. Global System in Package (SIP) Market Industry Development Trends under COVID-19 Outbreak
3.1.1. Global COVID-19 Status Overview
3.1.2. Influence of COVID-19 Outbreak on Global System in Package (SIP) Market Industry Development
3.1.3. Pre & Post COVID-19 Trends and Scenarios
3.2. Market Dynamics (Growth Impacting Factors & Rationales)
3.2.1. Drivers
3.2.1.1. Boom in portable electronic market and increase in popularity of Internet of Things (IoT)
3.2.1.2. Increasing Demand for Diminish of Electronic devices.
3.2.1.3. Usage in graphic cards and processors used in real world gaming
3.2.1.4. Driver 4
3.2.1.5. Driver 5
3.2.2. Restraints
3.2.2.1. Higher level of integration leads to thermal issues
3.2.2.2. Restraint 2
3.2.3. Opportunities
3.2.3.1. Potential use of RF components in developing advanced 5G infrastructure
3.2.3.2. Memory and Logic Integration
3.2.3.3. Opportunity 3
3.2.4. Impact Analysis of Drivers and Restraints
3.3. Ecosystem/ Value Chain Analysis
3.4. Porters Five Forces Analysis
3.5. SWOT Analysis
3.6. PEST Analysis
3.7. Average Selling Prices and Pricing Trends Analysis of System in Package (SIP) Market
3.8. Technological Roadmap
3.9. Key Investment Pockets of System in Package (SIP) Market
3.9.1. By Package Type
3.9.2. By Packaging Technology
3.9.3. By Packaging Method
3.9.4. By Device
3.9.5. By Application
3.9.6. By Regions
4. Global System in Package (SIP) Market: Estimates & Historic Trend Analysis (2020 to 2021)
4.1. Global System in Package (SIP) Market, 2020 2021 (US$ Million) & (Units)
4.2. Global System in Package (SIP) Market, By Package Type, 2020 to 2021 (US$ Million) & (Units)
4.3. Global System in Package (SIP) Market, By Packaging Technology, 2020 to 2021 (US$ Million) & (Units)
4.4. Global System in Package (SIP) Market, By Packaging Method, 2020 to 2021 (US$ Million) & (Units)
4.5. Global System in Package (SIP) Market, By Device, 2020 to 2021 (US$ Million) & (Units)
4.6. Global System in Package (SIP) Market, By Application, 2020 to 2021 (US$ Million) & (Units)
4.7. Global System in Package (SIP) Market, By Region, 2020 to 2021 (US$ Million) & (Units)
5. Global System in Package (SIP) Market Estimates & Forecast Trend Analysis, by Package Type
5.1. Global System in Package (SIP) Market Share (%) Estimates and Forecasts, by Package Type, 2022 & 2033
5.2. Global System in Package (SIP) Market Size (US$ Million) & (Units) Estimates and Forecasts, by Package Type, 2023 to 2033
5.2.1. Ball Grid Array (BGA)
5.2.2. Surface Mount Package (SOP)
5.2.3. Pin Grid Array (PGA)
5.2.4. Others
6. Global System in Package (SIP) Market Estimates & Forecast Trend Analysis, by Packaging Technology
6.1. Global System in Package (SIP) Market Share (%) Estimates and Forecasts, by Packaging Technology, 2022 & 2033
6.2. Global System in Package (SIP) Market (US$ Million) & (Units) Estimates and Forecasts, by Packaging Technology, 2023 to 2033
6.2.1. 2D IC Packaging Technology
6.2.2. 2.5D IC Packaging Technology
6.2.3. 3D IC Packaging Technology
7. Global System in Package (SIP) Market Estimates & Forecast Trend Analysis, by Packaging Method
7.1. Global System in Package (SIP) Market Share (%) Estimates and Forecasts, by Packaging Method, 2022 & 2033
7.2. Global System in Package (SIP) Market (US$ Million) & (Units) Estimates and Forecasts, by Packaging Method, 2023 to 2033
7.2.1. Flip Chip
7.2.2. Wire Bond
8. Global System in Package (SIP) Market Estimates & Forecast Trend Analysis, by Device
8.1. Global System in Package (SIP) Market Share (%) Estimates and Forecasts, by Device, 2022 & 2033
8.2. Global System in Package (SIP) Market (US$ Million) & (Units) Estimates and Forecasts, by Device, 2023 to 2033
8.2.1. RF Front End
8.2.2. RF Amplifier
9. Global System in Package (SIP) Market Estimates & Forecast Trend Analysis, by Application
9.1. Global System in Package (SIP) Market Share (%) Estimates and Forecasts, by Application, 2022 & 2033
9.2. Global System in Package (SIP) Market (US$ Million) & (Units) Estimates and Forecasts, by Application, 2023 to 2033
9.2.1. Consumer Electronics
9.2.1.1. Wearables
9.2.1.2. Mobile Handsets
9.2.1.3. Cameras
9.2.1.4. Others
9.2.2. Telecom, Communications and Infrastructure
9.2.3. Industrial
9.2.4. Others
10. Global System in Package (SIP) Market Analysis and Forecast, by Region
10.1. Global System in Package (SIP) Market Share (%) Estimates and Forecasts, by Region, 2022 & 2033
10.2. Global System in Package (SIP) Market (US$ Million) & (Units) Estimates and Forecasts, by Region, 2023 to 2033
10.2.1. North America
10.2.2. Europe
10.2.3. Asia Pacific
10.2.4. Middle East and Africa
10.2.5. Latin America
11. North America System in Package (SIP) Market: Estimates & Forecast Trend Analysis
11.1. North America System in Package (SIP) Market Assessments & Key Findings
11.2. North America System in Package (SIP) Market Share (%) Estimates and Forecasts, 2022 & 2033
11.3. North America System in Package (SIP) Market Size Estimates and Forecast (US$ Million) & (Units) (2023 to 2033)
11.3.1. By Package Type
11.3.2. By Packaging Technology
11.3.3. By Packaging Method
11.3.4. By Device
11.3.5. By Application
11.3.6. By Major Country
11.3.6.1. The U.S.
11.3.6.2. Canada
12. Europe System in Package (SIP) Market: Estimates & Forecast Trend Analysis
12.1. Europe System in Package (SIP) Market Assessments & Key Findings
12.2. Europe System in Package (SIP) Market Share (%) Estimates and Forecasts, 2022 & 2033
12.3. Europe System in Package (SIP) Market Size Estimates and Forecast (US$ Million) & (Units) (2023 to 2033)
12.3.1. By Package Type
12.3.2. By Packaging Technology
12.3.3. By Packaging Method
12.3.4. By Device
12.3.5. By Application
12.3.6. By Major Country
12.3.6.1. Germany
12.3.6.2. The U.K.
12.3.6.3. France
12.3.6.4. Italy
12.3.6.5. Spain
12.3.6.6. Rest of Europe (includes all other European countries)
13. Asia Pacific System in Package (SIP) Market: Estimates & Forecast Trend Analysis
13.1. Asia Pacific System in Package (SIP) Market Assessments & Key Findings
13.2. Asia Pacific System in Package (SIP) Market Share (%) Estimates and Forecasts, 2022 & 2033
13.3. Asia Pacific System in Package (SIP) Market Size Estimates and Forecast (US$ Million) & (Units) (2023 to 2033)
13.3.1. By Package Type
13.3.2. By Packaging Technology
13.3.3. By Packaging Method
13.3.4. By Device
13.3.5. By Application
13.3.6. By Major Country
13.3.6.1. China
13.3.6.2. Japan
13.3.6.3. India
13.3.6.4. ASEAN
13.3.6.5. South Korea
13.3.6.6. Rest of Asia Pacific (includes all other Asia Pacific countries)
14. Middle East & Africa System in Package (SIP) Market: Estimates & Forecast Trend Analysis
14.1. Middle East & Africa System in Package (SIP) Market Assessments & Key Findings
14.2. Middle East & Africa System in Package (SIP) Market Share (%) Estimates and Forecasts, 2022 & 2033
14.3. Middle East & Africa System in Package (SIP) Market Size Estimates and Forecast (US$ Million) & (Units) (2023 to 2033)
14.3.1. By Package Type
14.3.2. By Packaging Technology
14.3.3. By Packaging Method
14.3.4. By Device
14.3.5. By Application
14.3.6. By Major Country
14.3.6.1. GCC
14.3.6.2. South Africa
14.3.6.3. Egypt
14.3.6.4. Rest of Middle East & Africa (includes all other Middle East & Africa countries)
15. Latin America System in Package (SIP) Market: Estimates & Forecast Trend Analysis
15.1. Latin America Market Assessments & Key Findings
15.2. Latin America System in Package (SIP) Market Share (%) Estimates and Forecasts, 2022 & 2033
15.3. Latin America System in Package (SIP) Market Size Estimates and Forecast (US$ Million) & (Units) (2023 to 2033)
15.3.1. By Package Type
15.3.2. By Packaging Technology
15.3.3. By Packaging Method
15.3.4. By Device
15.3.5. By Application
15.3.6. By Major Country
15.3.6.1. Brazil
15.3.6.2. Mexico
15.3.6.3. Rest of Latin America (includes all other Latin America countries)
16. Competitive Landscape
16.1. Market Revenue Share Analysis (%), by Major Players (2021)
16.2. Market Competition Matrix, by Leading Players
16.3. List of Emerging, Prominent and Leading Players
16.4. Major Mergers & Acquisitions, Partnership, Joint Venture, Expansions, Deals, Recent Developments, etc.
17. Company Profiles
17.1. Amkor Technology
17.1.1. Company Overview & Insights
17.1.2. Financial Performance
17.1.3. Product / Service Portfolio
17.1.4. Geographical Footprint & Share
17.1.5. Strategic Initiatives & Key Developments
*Similar details would be provided for all the players mentioned below
17.2. Access
17.3. Analog Devices
17.4. Apple
17.5. ARM
17.6. ASE Group
17.7. Avago
17.8. AT&S
17.9. Bosch
17.10. Broadcom
17.11. Carsem
17.12. China WLCSP
17.13. Chipbond
17.14. ChipMOS
17.15. Cisco
17.16. Continental
17.17. Cyntec
17.18. Cypress
17.19. Semiconductor
17.20. Deca Technologies
17.21. Dyconex
17.22. Facebook
17.23. Fitbit
17.24. Flexceed
17.25. Flip Chip International
17.26. Formosa
17.27. Fraunhofer IZM
17.28. Freescale
17.29. Fujikura
17.30. Fujitsu
17.31. GaN Systems
17.32. General Electric
17.33. GlobalFoundries
17.34. Google
17.35. Hana Micron
17.36. Hella
17.37. Huawei
17.38. IMEC
17.39. Inari Berhad
17.40. Infineon
17.41. Intel
17.42. J-Devices
17.43. JCET
17.44. King Yuan
17.45. Lenovo
17.46. Linear Technology
17.47. LB Semicon
17.48. MediaTek
17.49. Medtronic
17.50. Meiko
17.51. Microchip
17.52. Microsemi
17.53. Nanium
17.54. Nepes
17.55. Nvidia
17.56. NXP
17.57. Nokia
17.58. ON Semiconductor
17.59. Orient Semiconductor
17.60. Powertech Technology Inc
17.61. Renesas
17.62. QDOS
17.63. Qorvo
17.64. Qualcomm
17.65. Rohm
17.66. Sarda Technologies
17.67. Samsung Electronics
17.68. Schweizer
17.69. SEMCO
17.70. SIMMTECH
17.71. SK Hynix,
17.72. Shinko
17.73. ShunSin
17.74. SiPlus
17.75. Softbank
17.76. SONY
17.77. SPIL
17.78. Spreadtrum
17.79. STMicroelectronics
17.80. STATS ChipPAC
17.81. STS Semiconductor
17.82. Taiyo Yuden
17.83. TDK
17.84. Teraprobe
17.85. Texas Instruments
17.86. Tianshui Huatian
17.87. Tongfu Microelectronics
17.88. Tong Hsing
17.89. Toshiba
17.90. TSMC
17.91. Unimicron
17.92. Unisem
17.93. USI
17.94. UTAC
17.95. Others
18. Assumptions and Research Methodology
18.1. Data Mining
18.2. Secondary Research
18.3. Primary Research
18.4. Subject Matter Expert Advice
18.5. Quality Check
18.6. Final Review
18.7. Data Triangulation
18.8. Bottom-Up Approach
18.9. Top Down Approach
18.10. Research Flow
18.11. Key Insights from Industry Experts
18.12. Data Sources
18.13. Assumptions
18.14. Limitations
19. Conclusions and Recommendations
19.1. Key Research Findings and Conclusion
19.2. Key Insights & Recommendations from Analysts