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Global Non-UV Dicing Tapes Market Analysis by Material Thickness, Thickness, Coating Type, Application, Region and segments forecast till 2033
Market Overview
The Global non-UV dicing tapes market size was USD 1,590 million in 2022, and is anticipated to grow to a value of more than USD 2,130 million by 2033, with a growing CAGR (compound annual growth rate) of over 6% from 2022 to 2033.
Report Scope
Report Attributes | Description |
Market Forecast in 2022 | USD 1,590 Million |
Market Forecast in 2033 | USD 2,130 Million |
CAGR % 2023-2033 | 6% |
Base Year | 2022 |
Historic Data | 2020-2021 |
Forecast Period | 2023-2033 |
Report USP | Production, Consumption, company share, company heatmap, company Material Production capacity, growth factors and more |
Segments Covered | Material Thickness, Thickness, Coating Type, Application |
Regional Scope | North America, Europe, APAC, South America and Middle East and Africa |
Country Scope | U.S.; Canada; U.K.; Germany; France; Italy; Spain; Benelux; Nordic Countries; Russia; China; India; Japan; South Korea; Australia; Indonesia; Thailand; Mexico; Brazil; Argentina; Saudi Arabia; UAE; Egypt; South Africa; Nigeria |
Key Companies | Pantech Tape Co. Ltd., Mitsui Chemicals Inc., AI Technology, Inc., Furukawa Electric Co. Ltd., LINTEC Corporation, Pantech Tape Co. Ltd, and QES GROUP BERHAD |
Non-ultraviolet (UV) Dicing Tapes Non-UV Dicing Tapes are thin adhesive tapes utilized during wafer manufacturing to keep bits of semiconductor intact during cutting. These tapes are generally adaptable movies made of PVC. These tapes can be effortlessly eliminated after the finishing of the dicing system. The tapes normally produced using polymers are extremely light, profoundly steady, very adaptable, gives a good boundary and is impervious to high pressure. The dicing tapes are exceptionally delicate to UV rays and their adhesives properties can modify when exposed. They are available in a more extensive range of thickness and expandability.
The interest for non-UV dicing tapes basically impacted by the expanded interest for the semiconductor fabricating industry. Non-UV dicing tapes are progressively acquiring inclination among semiconductor manufacturers because of the simple removal of chips from wafers after the dicing system. The reduction in size chips or ICS in electronic gadgets is diminished because of mechanical progressions. Subsequently, it is driving the non-UV dicing tapes market among IC makers. The interest for non-UV dicing tapes is supposed to be escalated by the rising electronic sturdy devices during the estimate time period.
PET is the most generally involved material for the assembling of non-UV dicing tapes, attributable for its potential benefits like light in weight, security, great boundary assurance, and high-pressure opposition presented by PET material. Non-UV dicing tapes generally utilized in wafer dicing applications. Besides, the developing prerequisite of electrical and electronic gadgets and different specialized advancements will likewise set out the gainful opportunities for the non-UV dicing tape market development. Also, expansion in the level of investment and arising new business sectors will go about as significant market drivers and further lift new open doors for the market's development.
Drivers: Increasing Demand for Semiconductor Production Tapes Will Drive the Market
The rising interest for semiconductor creation tapes has impacted non-UV dicing tapes market share. Non-UV dicing tapes are turning out to be more well known among semiconductor producers because of the simple to use with which chips might be eliminated from wafers after the dicing system, helping the interest for non-UV dicing tapes. The semiconductor industry is a key contributor to the global economy, with a significant impact on both manufacturing and services sectors. According to the World Semiconductor Trade Statistics (WSTS), the global semiconductor market was valued at around USD 500 billion in 2021, with a compound annual growth rate of around 6% over the past five years.
Asia is the largest region for semiconductor manufacturing, accounting for around 75% of global production. China, Japan, South Korea, and Taiwan are among the major producers of semiconductors in the region, with China being the fastest-growing market. In the United States, the government has introduced the CHIPS for America Act, which includes funding and incentives for semiconductor manufacturing and research. In Taiwan, the government has established the National Applied Research Laboratories (NARLabs) to promote innovation in the semiconductor industry.
Trends: Rising of Electronic Durable Gadgets Will Help the Market to Grow
The non-UV dicing tape market is principally determined by the surging number of electronic sturdy contraptions. Moreover, the rising prevalence of thin electronic things will pad the market's development rate. Furthermore, different factors, for example, expanded information on the advantages of PET-based non-UV dicing tape and mechanical progressions will impact the development of non- UV dicing tape market. Another critical driver that will extend the market's development rate is upsurge in the interest for PCs and other electrical gadgets.
Material Type Insights
The PET segment holds approximately 40% market share in the global non-UV dicing tapes Market, and expected to grow further. The non-UV dicing tapes market in the PET segment is growing steadily due to the increasing demand for high-performance dicing tapes in the semiconductor industry. PET (Polyethylene Terephthalate) is a high-strength polymer that provides excellent mechanical and thermal stability, making it an ideal material for use in dicing tapes.
Thickness Insights
The 85-125 Micron segment is expected to generate significant returns with more than 35% market share over the estimated timeframe as it is healthy and non-toxic in nature. The 85-125-micron segment is one of the most commonly used thickness ranges for non-UV dicing tapes in the semiconductor industry. These tapes provide excellent adhesion to the wafer surface, ensuring that the chips are diced accurately and without any damage.
Coating Type Insights
The Single sided segment rules the market with more than 50% market share and projected to grow more in the coming future years. The demand for non-UV dicing tapes with single-sided coating type is expected to be driven by the increasing demand for semiconductor devices and the need for precise dicing and packaging. The Asia-Pacific region is expected to lead the market due to the presence of major semiconductor manufacturers in countries such as Japan, South Korea, Taiwan, and China.
Application Insights
The non-UV dicing tapes market in the wafer dicing segment is a growing market due to the increasing demand for advanced semiconductor packaging solutions. Non-UV dicing tapes are used in the semiconductor manufacturing process to protect the wafers during dicing and ensure a precise and clean cut. These tapes offer several advantages over traditional UV tapes, such as improved accuracy, reduced contamination, and enhanced productivity.
Regional Insights
In term of geographic region, the Global non-UV dicing tapes market is divided into North America, Europe, Asia Pacific, Latin America, and Middle East and Africa.
Asia-Pacific dominates the market with the highest market share. Presence of a few market leaders in the locale is one of the main considerations contributing toward the development of the market. The global dicing tapes market is expected to grow at a moderate pace in the coming years, driven by the increasing demand for electronic devices such as smartphones, tablets, and laptops, which rely on semiconductor chips. The Asia-Pacific region, which includes Australia, is expected to be a key market for dicing tapes due to the presence of major semiconductor manufacturing hubs in countries such as China, Japan, South Korea, and Taiwan.
In Australia, the demand for dicing tapes is likely to be driven by the growth of the electronics industry and the increasing adoption of advanced technologies such as 5G, the Internet of Things (IoT), and artificial intelligence (AI). The government's focus on promoting innovation and research and development in the technology sector is also expected to support the growth of the semiconductor industry in Australia, which in turn could boost the demand for dicing tapes. Overall, while specific data on the growth of the non-UV dicing tapes market in Australia may not be available, the factors outlined above suggest that the dicing tapes market as a whole is likely to experience steady growth in the country in the coming years.
Competitive Analysis
Major players competing in Global non-UV dicing tapes market are Pantech Tape Co. Ltd., Mitsui Chemicals Inc., AI Technology, Inc., Furukawa Electric Co. Ltd., LINTEC Corporation, Pantech Tape Co. Ltd, and QES GROUP BERHAD.
In 2019, Nitto Denko Corporation, a leading manufacturer of dicing tapes, announced a collaboration with Toray Industries, Inc. to develop a new line of dicing tapes that offer improved adhesion and flexibility. The collaboration leveraged Toray's expertise in high-performance films and Nitto Denko's expertise in adhesive technologies.
In 2020, Mitsui Chemicals, Inc., another major player in the non-UV dicing tapes market, announced a collaboration with JSR Corporation, a specialty materials company, to develop new materials for use in semiconductor manufacturing. The collaboration aimed to leverage Mitsui Chemicals' expertise in high-purity materials and JSR's expertise in polymer chemistry to create new materials with improved properties for use in dicing tapes and other semiconductor-related applications.
Global Non-UV Dicing Tapes Market- Segmental Analysis
Based By Material Type:
PVC
PET
PO
Others
Based By Thickness:
85-125 Micron
126-150 Micron
Below 85 Micron
Above 150 Micron
Based By Coating Type:
Single sided
Double sided
Based By Application:
Wafer dicing
Package dicing
Others
Why to buy this Report?
The report provides quantitative and qualitative aspect for Global Non-UV Dicing Tapes Market in terms of value and volume, along with supporting market trends, challenges, restraints.
The report provides an in depth analysis from both Material Thicknession and consumption point of view at the regional and country level. Key Factors considered within the report scope are Material Thicknession capacity by countries/regions, average price, consumption ratio, revenue earned and gross margin.
The report provides competitive analysis of around 30-50 companies operated in Global Non-UV Dicing Tapes Market, these companies are bifurcated into niche players, the leaders and major contenders. The companies are analyzed in terms of following factors such as:
Business Model
Material Thicknession Capacity, Revenue, Sales, Gross Margin
Key Business Strategy
SWOT Analysis
In terms of competitive landscape, the report provides distinctive factors that would help the Card Coating Type in taking a key decision within the business:
Company Share Analysis from 2020-2022
Company Analysis by Revenue and Sales
Company Material Thicknession Capacity, Gross Margin
Company Share Analysis by Card Coating Type/Card Coating Type
Company Share Analysis by Material Thickness/Specification